• Ted Sun, Ayhan Mutlu, and Mahamad Rahman, “A New Statistical Methodology Predicting Chip Failure Probability Considering Electromigration,” Microelectronics Reliability Volume 53, Issue 12, Pages 1979– 1986, December 2013.
• Ted Sun, Ayhan Mutlu, and Mahamad Rahman, “Statistical Electromigration Analysis of a Chip with the Consideration of a Within-Die Temperature Map,” Session C2L-B, IEEE ISCAS, Beijing, May 19-23, 2013.
• Ted Sun, Ayhan Mutlu, and Mahamad Rahman, “A New Statistical Electromigration Analysis Methodology that Incorporates Across-Chip Temperature Variation,” Proc. 3rd ASQED Symposium, 2011, Kuala Lumpur, July 19-20, 2011.